| Product line | Product Name | Product Typical Application |
| Two- Component epoxy structural adhesive | DM-6030 | It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy resin is resistant to various chemicals and solvents, and has excellent dimensional stability in a wide temperature range. Typical applications include bonding, small potting, stubbing, and lamination. These applications require optical clarity and excellent structural, mechanical, and electrical insulation properties. |
| DM-6012 | The industrial window is wide, the operating time is 120min, and the bonding strength after curing is high. It is a high-viscosity industrial-grade epoxy adhesive with long service life. Once mixed, the two-component epoxy resin cures at room temperature to form a tough, amber-colored contact surface with excellent peel and impact resistance. The fully cured epoxy resin has excellent thermal shock resistance, excellent mechanical and electrical properties, and can withstand the erosion of various solvents and chemicals. Typical applications include bonding nose cones in aerospace applications. Suitable for general industrial applications with low stress, high impact and high peel strength. Bonding different materials including metals such as aluminum and steel, as well as various plastics and ceramics. |
| DM-6003 | It is a two-component epoxy resin structural adhesive. At room temperature (25°C), the operating time is 20 minutes, the curing position is 90 minutes, and the curing is complete in 24 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. Suitable for bonding most metals, ceramics, rubber, plastics, wood, stone, etc. |
| DM-6063 | It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines. |
English
